- The lead frame is a metal substrate that supports the semiconductor chip, which connects external electrodes and supports the semiconductor package to secure the electronic circuit board.
- The plating and surface treatment of lead frames is progressing day by day to meet the ever-increasing mounting density of semiconductor packages and chip performance.
- Recent plating technology, Micro PPF (ultrathin gold-plated), Roughness, improved adhesion between the package and the lead frame such as Spot, proceed with the plating only small areas to ensure competitive prices.
In addition, plating to simplify the post-process is gradually spreading.
Product Type
QFJ, SOJ, TQFP, LQFP, QFP, TSOP, SSOP, SOP, ZIP, SDIP, DIP, QFN, etc
Plating specification
- Ag Selective / Ag Full / Ag Spot / Ni+Sn / NiNiP / Sn
- Respond to customer requirements
